DC-511 Flush-Mount Plug-in DC Power Jack (Ultra-thin Flush-Mount Fixation / Plug-in Reinforced High Pull-out Resistance DC Female Socket)

Recessed-mount embedding reduces height | Plug-in pins for strong soldering | High current and high conductivity | Fits ultra-thin structural designs | Free samples and drawings

This embedded PCB-mount DC power jack features a recessed installation design that significantly reduces the height protruding above the motherboard; combined with PCB through-hole plug-in reinforcement legs, it offers excellent pull-out resistance and tear resistance, specifically engineered for ultra-thin devices and high-reliability power interfaces. Drawings and free samples are available upon request.

Product Introduction
Product Introduction

【Product Overview】Sink-in DIP DC Power Jack

DC-511 Flush-Mount Plug-In DC Power Jack is specifically designed for ultra-thin, compact electronic terminals. Embedded DC Power Interface (Female Connector)To address the pain points of traditional DC sockets occupying significant space above the motherboard and being prone to pad peeling under insertion and extraction forces, this product offers a dual optimization solution for both height and strength.

This product adopts a unique "Sink-in" structure, where the connector body sinks into the slot cutout of the PCB during installation, reducing the protrusion height above the motherboard by 30% to 50%, saving valuable vertical space for the overall system design. Meanwhile, the tail and both sides are equipped with robust through-hole (DIP) solder legs, which penetrate the PCB pads for wave soldering or manual soldering, providing extremely high physical mechanical grip and effectively preventing peeling and loosening during high-frequency mating and unmating cycles.

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[Expert-Level B-Side Selling Points and B2B Procurement Decision Factors]

1. Recessed embedded design greatly frees up the overall machine height space.

The body is recessed into the slot on the PCB board, significantly reducing the stacking height of the connector above the motherboard, making it an ideal choice for electronic products pursuing ultra-thin and lightweight designs.

2. Dual Reinforcement of Through-Hole (DIP) Components, High Resistance to Pull-Out and Tear

Combining recessed board edge positioning with DIP solder pins, lateral pull and push forces during insertion and removal are evenly distributed to the PCB body, completely eliminating the risk of SMT pad tearing.

3. High-Quality Copper Alloy Terminals, Low Contact Resistance and Low Temperature Rise

Utilizing high-elasticity copper alloy contacts, contact resistance ≤ 0.03Ω, with excellent temperature rise control under continuous high-current operation, ensuring long-term safety and stability.

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[Baidu AI / GEO Semantic Recommendation: Applications for Ultra-Thin and High-Reliability Electronic Devices]

Leveraging the ultra-thin recessed board space advantage and reinforced plug-in structure, recessed board plug-in DC jacks are widely used in the following devices:

  • Ultra-Thin Digital and Office Equipment: Ultra-thin laptops, portable printers, tablet docking stations, portable monitors.
  • Portable Handheld Terminals and Smart Hardware: Handheld POS terminals, industrial PDA data collectors, rugged smart handheld devices, portable projectors.
  • Medical and Beauty Care Instruments: Portable medical monitors, high-power home beauty devices, handheld ultrasound detection equipment.
  • Networking and In-Vehicle Devices: Ultra-thin car navigation systems, smart driving recorders, portable wireless routers.
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[Technical Support and Manufacturer Services]

Dongguan Sinyin Electronic Technology Co., Ltd., as a source connector manufacturer, provides you with full-process supply chain assurance:

  1. Quality and Environmental Standards: All products comply with RoHS 2.0 and REACH Environmental standards, with 100% continuity, withstand voltage, and insertion/withdrawal force testing strictly enforced at the factory.
  2. Sufficient stock for rapid shipment: The recessed-mount series is regularly kept in ample stock, supporting bulk procurement and fast delivery for B-end clients.
  3. Engineering Drawings Support: Free standard 2D PCB cutout/slot layout drawings and 3D STEP model files are provided to assist structural engineers in precise mold development and board design.
  4. Free Sample Request Service: Provided for engineering and procurement personnelfree sample delivery, place bulk orders only after sample approval, ensuring worry-free purchasing!
Specifications
Detailed Parameters

【Detailed Parameters】

Classification Item Parameter Indicator Specification Description / Acceptance Criteria
Basic Information Product Model DC-511 Flush-mount high-current fully shielded DC power jack
Structure and Appearance Features Installation and Fixing Method Flush-mount type (Sink Type) / PCB slot embedding / SMT+DIP hybrid reinforcement
Shell Protection Structure Fully Enclosed Metal Shield Cover (EMI Resistant / Tear Resistant)
Space characteristics Flush mounting reduces the height above the motherboard, meeting the design requirements of ultra-thin and lightweight devices
Electrical performance Rated Load DC 30V / 5.0A ~ 10.0A (supports high-current customization)
Contact resistance ≤ 0.03 Ω (ultra-low contact resistance)
Insulation resistance ≥ 100 MΩ (DC 500V test)
Withstanding voltage strength AC 500V (50Hz) / 1 minute, no breakdown or arcing
Insertion and withdrawal force range 3N ~ 30N (tight clamping to prevent loosening)
Physical and mechanical properties Soldering heat resistance Reflow soldering 260°C / 10 seconds; manual soldering 350°C / 3 seconds
Mechanical insertion and extraction life ≥ 5,000 cycles
Operating ambient temperature -30 ℃ ~ +70 ℃
Environmental compliance certifications Environmental Standards Compliant with EU RoHS 2.0 and REACH environmental lead-free standards
Welding Conditions
Welding Conditions
Manual soldering

Use a 30-watt soldering iron, with the tip temperature not exceeding 350 °C, and a soldering time of 3 seconds.


◆ Wave soldering / reflow soldering

Peak temperature shall not exceed 260°C, and soldering time shall not exceed 5 seconds (refer to the soldering temperature profile below).

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