Product Overview

The Sinyinda SYCBCHY6P2D4XF is a 2+4 composite power-signal socket female connector designed for precision-grade board-end power-signal collaborative scenarios. This product achieves stable board-end interconnection of 2 channels of 30A power + 4 channels of 1A high-precision signal within a compact package of only 32×24mm, adopting copper gold-plating (0.76μm) high-spec contact technology with contact resistance ≤5mΩ and resistance to reflow soldering high temperatures without discoloration, ensuring long-term integrity of weak analog signals and digital communications. Rated voltage DC 250V, operating temperature -55℃~+125℃, LCP insulating substrate supports SMT mounting process, PCB sink-board soldering structure provides ≥80N pull-out resistance, recommended mating cycle life of 500 times. It is particularly suited for precision application scenarios with rigid requirements for "compact board-end 30A power supply + 4-channel high-precision signal synchronization + SMT mounting compatibility," such as medical monitor motherboard interfaces, industrial sensor hubs, UAV onboard power distribution modules, and laboratory analytical instrument backplanes, precisely mating with the male connector SYCBCHY6P2D4XM to form a complete precision-grade composite interconnection solution.

Board-End Exclusive Core Advantages (Gold-Plated Version)

• Copper Gold-Plated (0.76μm) Solder-Resistant Contacts:The gold plating layer thickness reaches 0.76μm (30μin), with a 2μm nickel underlayer effectively blocking copper diffusion. After 260℃/30s reflow soldering, the plating shows no discoloration or blistering, with a contact resistance change rate of <3%; the chemical inertness of the gold layer ensures no oxidation during long-term use in medical equipment disinfection environments and laboratory corrosive atmospheres, with a lifespan far exceeding tin-plated or silver-plated solutions.
• PCB Sink-Board Soldering Structure:The main circuit terminals adopt an extended fish-eye press-fit zone + through-hole soldering dual fixation, with solder joint pull-out resistance ≥80N, 3 times stronger than pure SMT pads; the signal terminals use Gull Wing wing-shaped pins with coplanarity ≤0.1mm, meeting IPC-A-610 Class 3 soldering standards, avoiding signal intermittency faults caused by cold solder joints.
• LCP Substrate SMT Mounting Compatibility:The liquid crystal polymer (LCP) material has a CTI value ≥600V, water absorption rate <0.02%, requiring no pre-baking before reflow soldering; the coefficient of thermal expansion (CTE) matches well with FR4 PCB (X/Y axis 12ppm/℃), with no solder joint cracks after 1000 cycles from -55℃ to +125℃, suitable for high-reliability automotive and avionics applications.
• 30A board-end heat dissipation path optimization:Two thermal pads are added at the bottom of the main circuit terminals to conduct heat through the PCB inner copper layers to a heatsink or metal enclosure. At 30A full load, the terminal temperature rise is <25K (ambient temperature 25°C, 2oz copper PCB); the LCP substrate has a thermal conductivity of 0.3W/m·K, a 50% improvement over standard PA66, preventing local hot spots from causing substrate creep.
• 4-channel signal EMI shielding design:Grounding spring clips are integrated on both sides of the housing, providing 360° contact with the PCB ground plane. A metal partition inside the signal area isolates it from the main circuit, achieving EMI suppression >50dB@100MHz; signal terminal pitch is 1.5mm, supporting differential routing layouts to ensure μV-level analog sampling signals are not interfered with by 30A switching noise.
• -55℃~+125℃ Wide Temperature Tolerance:The LCP substrate offers excellent low-temperature toughness, with no cracking upon impact at -55°C; dimensional change rate is <0.1% at high temperature 125°C, meeting the requirements of extreme temperature differential environments such as avionics equipment and polar research instruments; the optional sealing gasket has a compression set rate of <15%, maintaining IP54 protection rating during long-term use.

Vertical application guide for board-end connectors